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LMP7707MA/NOPB - Texas Instruments

Description: Texas Instruments LMP7707MA/NOPB Precision Op Amp, 15MHz Rail-Rail, 2.7 → 12 V, 8-Pin SOIC

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LMP7707MA/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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LMP7707MA/NOPB - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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LMP7707MA/NOPB Details

  • Manufacturer Part Number:

    LMP7707MA/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000001 µA

  • Bias Current-Max (IIB) @25C:

    0.000001 µA

  • Common-mode Reject Ratio-Min:

    88 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    200 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    5.6 V/us

  • Supply Current-Max:

    1.1 mA

  • Supply Voltage Limit-Max:

    13.2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    14000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    3.9 mm

LMP7707MA/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-frequency PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using bypass capacitors to reduce noise and oscillations.
  • The choice of input and output capacitors depends on the specific application and operating conditions. In general, X7R or X5R ceramic capacitors with a voltage rating of at least 2x the maximum input voltage are recommended. The capacitance value should be chosen based on the desired cutoff frequency and impedance matching requirements.
  • The maximum power dissipation of the LMP7707MA is dependent on the operating conditions, such as supply voltage, output current, and ambient temperature. The power dissipation can be calculated using the formula: Pd = (Vcc x Icc) + (Vout x Iout). It's recommended to use a thermal pad and a heat sink to ensure reliable operation and to prevent overheating.
  • To ensure EMC, it's recommended to follow general EMC design guidelines, such as using a shielded enclosure, minimizing loop areas, and using filtering components, such as ferrite beads and common-mode chokes. Additionally, the LMP7707MA has built-in EMI filtering, but it's still important to follow proper PCB design and layout practices to minimize radiated emissions.
  • The recommended operating temperature range for the LMP7707MA is -40°C to 125°C. However, the device can operate up to 150°C with reduced performance and reliability. It's recommended to follow the thermal derating guidelines provided in the datasheet to ensure reliable operation.

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LMP7707MA/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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