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LT1634BCS8-1.25#TRPBF - Analog Devices

Description: IC VREF SHUNT 1.25V 8SOIC

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LT1634BCS8-1.25#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S8 Package 8-Lead Plastic SOIC*
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LT1634BCS8-1.25#TRPBF - Analog Devices  - 3D model - Small Outline Packages - S8 Package 8-Lead Plastic SOIC*
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LT1634BCS8-1.25#TRPBF Details

  • Manufacturer Part Number:

    LT1634BCS8-1.25#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, LEAD FREE, PLASTIC, SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1610 (S8)

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    TWO TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9025 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Voltage-Max:

    1.25281 V

  • Output Voltage-Min:

    1.24718 V

  • Output Voltage-Nom:

    1.25 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.752 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temp Coef of Voltage-Max:

    25 ppm/°C

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Width:

    3.875 mm

LT1634BCS8-1.25#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1634BCS8-1.25 involves keeping the input and output traces short and separate, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended compensation network, use a minimum output capacitance of 10uF, and keep the input and output resistors within the recommended range. Also, avoid using long input traces and ensure that the device is properly decoupled.
  • The maximum power dissipation of the LT1634BCS8-1.25 is dependent on the ambient temperature and the thermal resistance of the package. For the SOIC-8 package, the maximum power dissipation is approximately 1.4W at 25°C ambient temperature.
  • The LT1634BCS8-1.25 is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the power dissipation and ensure proper thermal management to ensure reliable operation.
  • To troubleshoot oscillations or instability issues, check the PCB layout for any signs of resonance or coupling, ensure that the input and output capacitors are properly selected, and verify that the compensation network is correctly implemented. Also, check for any signs of overheating or excessive power dissipation.

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LT1634BCS8-1.25#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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