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LT1713CMS8#TRPBF - Analog Devices

Description: Comparator Single R-R I/O ±6V/12V 8-Pin MSOP T/R

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LT1713CMS8#TRPBF - Analog Devices - PCB symbol
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LT1713CMS8#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8 Package 8-Lead Plastic MSOP_2022
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LT1713CMS8#TRPBF - Analog Devices - 3D model - Small Outline Packages - MS8 Package 8-Lead Plastic MSOP_2022
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LT1713CMS8#TRPBF Details

  • Manufacturer Part Number:

    LT1713CMS8#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    5 µA

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6.3 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    8.5 ns

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage Limit-Max:

    6.3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LT1713CMS8#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1713 involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, avoid using long input and output traces, and keep the device away from noise sources.
  • The LT1713 is rated for operation from -40°C to 125°C. However, the device's performance may degrade at extreme temperatures, so it's essential to ensure proper thermal management and heat sinking in high-temperature applications.
  • Yes, the LT1713 is a radiation-hardened device that meets the requirements for high-reliability and aerospace applications. However, it's essential to follow the recommended design and manufacturing guidelines to ensure the device meets the required standards.
  • To troubleshoot issues with the LT1713, start by checking the PCB layout and component values against the recommended design guidelines. Ensure that the input and output capacitors are of high quality and have low ESR. Also, check for noise sources and ensure proper decoupling. If the issue persists, consult the datasheet and application notes for further guidance.

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LT1713CMS8#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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