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LT3476IUHF#TRPBF - Analog Devices

Description: LED Lighting Drivers High Current Quad Output LED Driver in QFN (5x7)

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PCB Footprints
LT3476IUHF#TRPBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UHF Package 38-Lead Plastic QFN (5mm × 7mm)
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3D Models
LT3476IUHF#TRPBF - Analog Devices  - 3D model - Quad Flat No-Lead - UHF Package 38-Lead Plastic QFN (5mm × 7mm)
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LT3476IUHF#TRPBF Details

  • Manufacturer Part Number:

    LT3476IUHF#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    5 X 7 MM, LEAD FREE, PLASTIC, MO-220WHKD, QFN-38

  • Pin Count:

    38

  • Manufacturer Package Code:

    05-08-1701

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PQCC-N38

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    8

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC38,.2X.28,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    16 V

  • Supply Voltage-Min:

    2.8 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

LT3476IUHF#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT3476IUHF#TRPBF involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing trace lengths and widths to reduce EMI and noise. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability and prevent oscillations, make sure to follow the recommended component values and layout guidelines in the datasheet. Additionally, ensure that the output capacitor has a low ESR and is placed close to the IC. Also, avoid using capacitors with high ESL values.
  • The maximum ambient temperature for reliable operation of the LT3476IUHF#TRPBF is 85°C. However, the device can operate up to 125°C with derating. It's essential to ensure proper thermal management and heat sinking to maintain a safe operating temperature.
  • While it's possible to use a different inductor value or type, it's not recommended. The recommended inductor values and types are carefully selected to ensure optimal performance and efficiency. Using a different inductor may affect the converter's stability, efficiency, and output voltage regulation.
  • To troubleshoot issues with the converter, start by checking the input voltage, output voltage, and current. Verify that the component values and layout match the recommended design. Check for signs of overheating, and ensure that the input and output capacitors are properly selected and placed. Use an oscilloscope to measure the output voltage ripple and switching frequency.

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LT3476IUHF#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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