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LT3575IFE#TRPBF - Analog Devices

Description: Isolated Flyback Converter without an Opto-Coupler

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LT3575IFE#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - FE Package 16-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663 Rev L) Exposed Pad Variation BA
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LT3575IFE#TRPBF - Analog Devices  - 3D model - Small Outline Packages - FE Package 16-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663 Rev L) Exposed Pad Variation BA
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LT3575IFE#TRPBF Details

  • Manufacturer Part Number:

    LT3575IFE#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    4.40 MM, LEAD FREE, PLASTIC, TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1663 (BA)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    4.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LT3575IFE#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the LT3575's performance. It's recommended to follow the layout guidelines provided in the datasheet, including keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing trace lengths and widths.
  • To ensure good thermal performance, make sure to provide adequate heat sinking, such as a thermal pad or a heat sink, and ensure good airflow around the device. Also, follow the recommended operating conditions and avoid exceeding the maximum junction temperature.
  • The recommended input capacitor type is a low-ESR ceramic capacitor, such as an X5R or X7R dielectric, with a value of 10uF to 22uF. This helps to filter out noise and ensure stable operation.
  • The feedback network should be configured to provide a stable and accurate output voltage. This typically involves selecting the correct resistors and capacitors for the feedback network, and ensuring that the feedback pin is properly connected to the output voltage.
  • The maximum output current capability of the LT3575 is 3A. However, this can be limited by the input voltage, output voltage, and thermal performance. Be sure to check the datasheet for specific current limits and thermal derating curves.

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LT3575IFE#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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