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LT3598IUF#TRPBF - Analog Devices

Description: LED Lighting Drivers 6-String 30mA LED Driver with +/-1.5% Current Matching

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LT3598IUF#TRPBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UF Package 24-Lead Plastic QFN (4mm × 4mm)_)
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LT3598IUF#TRPBF - Analog Devices  - 3D model - Quad Flat No-Lead - UF Package 24-Lead Plastic QFN (4mm × 4mm)_)
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LT3598IUF#TRPBF Details

  • Manufacturer Part Number:

    LT3598IUF#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    4 X 4 MM, LEAD FREE, PLASTIC, MO-220WGGD-X, QFN-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    05-08-1697

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    S-PQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    60

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    30 V

  • Supply Voltage-Min:

    3.2 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

LT3598IUF#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT3598IUF involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing the length of the input and output traces. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The compensation network for the LT3598IUF involves selecting the right values for the compensation resistors and capacitors. A good starting point is to use the values recommended in the datasheet, and then adjust them based on the specific application requirements and the desired transient response.
  • The maximum ambient temperature range for the LT3598IUF is -40°C to 125°C. However, the device can operate at a higher temperature range with derating. It's essential to ensure that the device does not exceed the maximum junction temperature of 150°C.
  • Yes, the LT3598IUF is suitable for high-reliability applications. It's manufactured using a high-reliability process, and it's qualified to automotive and industrial standards. However, it's essential to follow proper design and manufacturing practices to ensure the reliability of the final product.
  • To ensure the stability of the LT3598IUF, it's essential to follow the recommended layout and compensation guidelines, use the correct input and output capacitors, and ensure that the device is operated within its recommended operating conditions. Additionally, it's recommended to perform a thorough stability analysis using simulation tools or bench testing.

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LT3598IUF#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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