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LT5560EDD#TRPBF - Analog Devices

Description: RF Mixer 0.01MHz to 4GHz Low Power Active Mixer

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LT5560EDD#TRPBF - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - LT3020IDD#PBF
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LT5560EDD#TRPBF - Analog Devices  - 3D model - Small Outline No-lead - LT3020IDD#PBF
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LT5560EDD#TRPBF Details

  • Manufacturer Part Number:

    LT5560EDD#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1698

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    140 MHz

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • uPs/uCs/Peripheral ICs Type:

    DSP PERIPHERAL, MIXER

LT5560EDD#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT5560EDD involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, adding a small resistor (e.g., 10Ω) in series with the output can help dampen oscillations.
  • The maximum power dissipation of the LT5560EDD is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this can be derated to 0.7W at 85°C ambient temperature.
  • Yes, the LT5560EDD can be used in a switching regulator application. However, it's essential to ensure that the device is operated within its recommended operating conditions, and the switching frequency is within the device's bandwidth. Additionally, proper PCB layout and component selection are crucial to minimize electromagnetic interference (EMI) and ensure reliable operation.
  • To troubleshoot issues with the LT5560EDD, start by verifying the power supply voltage, input signal, and output load. Check for proper PCB layout, decoupling, and component selection. Use an oscilloscope to inspect the input and output waveforms, and ensure that the device is operating within its recommended specifications. Consult the datasheet and application notes for guidance on troubleshooting common issues.

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LT5560EDD#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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