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LT6703HDC-3#TRPBF - Analog Devices

Description: Comparator Standard (General Purpose) Open-Collector 3-DFN (2x2)

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LT6703HDC-3#TRPBF - Analog Devices PCB footprint - Other - Other - DC Package 3-Lead Plastic DFN (2mm × 2mm)-10
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LT6703HDC-3#TRPBF - Analog Devices  - 3D model - Other - DC Package 3-Lead Plastic DFN (2mm × 2mm)-10
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LT6703HDC-3#TRPBF Details

  • Manufacturer Part Number:

    LT6703HDC-3#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    2 X 2 MM, LEAD FREE, PLASTIC, MO-229, DFN-4/3

  • Pin Count:

    3

  • Manufacturer Package Code:

    05-08-1717

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.01 µA

  • JESD-30 Code:

    S-PDSO-N3

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-COLLECTOR

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC3/6,.09,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    29000 ns

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    17 mA

  • Supply Voltage Limit-Max:

    18.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

LT6703HDC-3#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT6703HDC-3 involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended compensation network, use a minimum output capacitance of 10uF, and keep the input and output resistors within the recommended range. Additionally, ensure that the device is operated within its specified voltage and current ranges.
  • The maximum power dissipation of the LT6703HDC-3 is dependent on the ambient temperature and the thermal resistance of the package. For the 3x3mm QFN package, the maximum power dissipation is approximately 1.5W at 25°C ambient temperature.
  • The LT6703HDC-3 is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the device's power dissipation and ensure proper thermal management to ensure reliable operation.
  • To troubleshoot oscillations or instability issues, check the PCB layout for any noise or signal coupling, ensure that the input and output capacitors are properly sized and placed, and verify that the device is operated within its specified voltage and current ranges. Additionally, check for any signs of overheating or thermal issues.

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LT6703HDC-3#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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