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LTC1418ACG#PBF - Analog Devices

Description: 14 Bit Analog to Digital Converter 1 Input 1 SAR 28-SSOP

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LTC1418ACG#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - SSOP
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LTC1418ACG#PBF Details

  • Manufacturer Part Number:

    LTC1418ACG#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    05-08-1640 (G28)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Input Voltage-Max:

    2.048 V

  • Analog Input Voltage-Min:

    -2.048 V

  • Conversion Time-Max:

    4 µs

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Negative Supply Voltage-Nom:

    -5 V

  • Number of Analog In Channels:

    1

  • Number of Bits:

    13

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    70 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL, PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.2 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    5.3 mm

LTC1418ACG#PBF Frequently Asked Questions (FAQs)

  • The recommended layout and routing for the LTC1418ACG involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the ADC and the analog input pins. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog power plane and a dedicated digital power plane.
  • To optimize the performance of the LTC1418ACG in noisy environments, it's recommended to use a low-pass filter at the analog input pins, use a shielded cable for the analog input signals, and keep the ADC away from high-frequency noise sources. Additionally, using a ferrite bead or a common-mode choke can help to reduce electromagnetic interference (EMI).
  • The maximum sampling rate that can be achieved with the LTC1418ACG is 1.25Msps (million samples per second) at 14-bit resolution. However, the actual sampling rate may be limited by the system clock frequency, the analog input bandwidth, and the digital output data rate.
  • The LTC1418ACG does not require calibration for optimal performance. However, it's recommended to perform a self-test or a system-level calibration to ensure that the ADC is functioning correctly and to compensate for any system-level errors or offsets.
  • The power consumption of the LTC1418ACG depends on the operating mode, the sampling rate, and the supply voltage. In normal operation, the typical power consumption is around 35mW at 3.3V supply voltage and 1.25Msps sampling rate. In power-down mode, the typical power consumption is around 10μW.

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LTC1418ACG#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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