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LTC1473CGN#TRPBF - Analog Devices

Description: IC OR CTRLR SRC SELECT 16SSOP

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LTC1473CGN#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - GN Package 16-Lead Plastic SSOP (Narrow .150 Inch)
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LTC1473CGN#TRPBF - Analog Devices  - 3D model - Small Outline Packages - GN Package 16-Lead Plastic SSOP (Narrow .150 Inch)
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LTC1473CGN#TRPBF Details

  • Manufacturer Part Number:

    LTC1473CGN#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, PLASTIC, SSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1641 (GN16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    30 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    20 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9116 mm

LTC1473CGN#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC1473CGN involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the IC and the capacitors. A 4-layer board with a dedicated ground plane is recommended. Additionally, the datasheet provides a recommended layout diagram that can be used as a reference.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout. Additionally, make sure to decouple the power supply pins with ceramic capacitors, and use a low-ESR capacitor for the output filter. Also, avoid using long traces or wires for the feedback loop, and keep the input and output capacitors close to the IC.
  • The maximum input voltage that the LTC1473CGN can handle is 15V. However, it's recommended to operate the device within the specified input voltage range of 3.5V to 12V to ensure reliable operation and to prevent damage to the IC.
  • The LTC1473CGN is rated for operation from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to follow the recommended operating conditions and to ensure proper thermal management to prevent overheating.
  • To troubleshoot issues with the LTC1473CGN, start by checking the power supply voltage, input voltage, and output voltage. Verify that the component values and PCB layout match the recommended configuration. Use an oscilloscope to check for oscillations or noise on the output. If the issue persists, consult the datasheet and application notes for troubleshooting guidelines.

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LTC1473CGN#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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