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LTC1473IGN#PBF - Analog Devices

Description: Dual PowerPathTM Switch Driver, SSOP-16

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LTC1473IGN#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - GN Package 16-Lead Plastic SSOP (Narrow 0.150)_1
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LTC1473IGN#PBF - Analog Devices  - 3D model - Small Outline Packages - GN Package 16-Lead Plastic SSOP (Narrow 0.150)_1
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LTC1473IGN#PBF Details

  • Manufacturer Part Number:

    LTC1473IGN#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, PLASTIC, SSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1641 (GN16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    30 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    20 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9116 mm

LTC1473IGN#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC1473IGN#PBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • The LTC1473IGN#PBF requires a single 3.3V or 5V power supply. It's recommended to use a low-noise, low-dropout regulator to power the device. The power sequencing requirement is to power up the device after the power supply has stabilized, and to ensure that the power supply is within the recommended operating range.
  • The LTC1473IGN#PBF can support clock frequencies up to 50 MHz. However, the maximum clock frequency may vary depending on the specific application and the quality of the clock signal.
  • The LTC1473IGN#PBF can be configured for different voltage ranges by adjusting the voltage reference and the gain settings. However, the device has limitations on the minimum and maximum voltage ranges, and the user should consult the datasheet for specific details.
  • The LTC1473IGN#PBF has a maximum junction temperature of 150°C. To ensure proper heat dissipation, it's recommended to use a heat sink or a thermal pad, and to ensure good airflow around the device. The user should also follow proper PCB design guidelines to minimize thermal resistance.

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LTC1473IGN#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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