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LTC1867LAIGN#TRPBF - Analog Devices

Description: Micropower, 3V, 16-Bit, 8-Channel 175ksps ADCs

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LTC1867LAIGN#TRPBF - Analog Devices - PCB symbol
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PCB Footprints
LTC1867LAIGN#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - GN Package 16-Lead Plastic SSOP (Narrow .150 Inch)
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LTC1867LAIGN#TRPBF - Analog Devices - 3D model - Small Outline Packages - GN Package 16-Lead Plastic SSOP (Narrow .150 Inch)
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LTC1867LAIGN#TRPBF Details

  • Manufacturer Part Number:

    LTC1867LAIGN#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1641 (GN16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog Input Voltage-Max:

    1.25 V

  • Analog Input Voltage-Min:

    -1.25 V

  • Conversion Time-Max:

    3.7 µs

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Linearity Error-Max (EL):

    0.0046%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    8

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.175 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    2.7 mA

  • Supply Voltage-Nom:

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.899 mm

LTC1867LAIGN#TRPBF Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LTC1867LAIGN#TRPBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a low-ESR capacitor for the VCC pin and to keep the input and output traces short and away from noise sources.
  • To ensure accuracy and stability of the ADC conversion results, it's essential to provide a clean and stable power supply, use a high-quality reference voltage, and minimize noise and interference on the input signals. Additionally, it's recommended to use a low-pass filter on the input signals and to use the internal clock or a high-quality external clock source.
  • The maximum sampling rate of the LTC1867LAIGN#TRPBF is 1.5Msps, and it can be achieved by using the internal clock or an external clock source. The power consumption of the device increases with the sampling rate, so it's essential to consider the power budget and thermal management when operating at high sampling rates.
  • The LTC1867LAIGN#TRPBF can be interfaced with a microcontroller or FPGA using the SPI or I2C communication protocols. The recommended protocol depends on the specific application requirements, but SPI is generally faster and more suitable for high-speed applications. It's essential to follow the protocol specifications and timing requirements to ensure reliable communication.
  • The LTC1867LAIGN#TRPBF has a maximum junction temperature of 150°C, and it's essential to ensure that the device operates within the recommended temperature range. Thermal management considerations include using a heat sink, providing adequate airflow, and minimizing power consumption. It's also recommended to use a thermally conductive material for the PCB and to follow the recommended layout and placement guidelines.

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LTC1867LAIGN#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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