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LTC2313ITS8-12#TRMPBF - Analog Devices

Description: 12-Bit, 2.5Msps Serial Sampling ADC in TSOT -40°C ~ 125°C,2.7V ~ 3.6V, 5V

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PCB Footprints
LTC2313ITS8-12#TRMPBF - Analog Devices PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - TS8 Package 8-Lead Plastic TSOT-23
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LTC2313ITS8-12#TRMPBF - Analog Devices  - 3D model - SOT23 (8-Pin) - TS8 Package 8-Lead Plastic TSOT-23
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LTC2313ITS8-12#TRMPBF Details

  • Manufacturer Part Number:

    LTC2313ITS8-12#TRMPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MO-193, TSOT-23, 8 PIN

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1637

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    2.056 V

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Linearity Error-Max (EL):

    0.0366%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    2.5 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    4.4 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.625 mm

LTC2313ITS8-12#TRMPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2313 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the analog input traces. Additionally, it's recommended to place the ADC near the analog signal sources and to use a low-impedance power supply.
  • To ensure accurate conversions, it's essential to provide a clean and stable power supply, minimize noise and interference, and use a high-quality clock source. Additionally, proper PCB layout, grounding, and shielding can help reduce errors.
  • The maximum sampling rate of the LTC2313 is 1.5Msps (mega-samples per second). However, this rate can be affected by the clock frequency, conversion mode, and other factors, so it's essential to consult the datasheet for specific details.
  • Yes, the LTC2313 can be used with an external reference voltage. The device has a dedicated REF pin that can be connected to an external reference voltage source. This allows for greater flexibility and accuracy in the conversion process.
  • The LTC2313 can be interfaced with a microcontroller using a serial interface, such as SPI or I2C. The specific interface protocol depends on the microcontroller and the application requirements. Consult the datasheet and the microcontroller's documentation for more information.

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LTC2313ITS8-12#TRMPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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