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LTC2323IUFD-16#TRPBF - Analog Devices

Description: Dual, 16-Bit, 5Msps Differential Input ADC with Wide Input Common Mode Range

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PCB Footprints
LTC2323IUFD-16#TRPBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UFD Package 28-Lead Plastic QFN (4mm × 5mm) (Reference LTC DWG # 05-08-1712 Rev C)-ren1
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3D Models
LTC2323IUFD-16#TRPBF - Analog Devices  - 3D model - Quad Flat No-Lead - UFD Package 28-Lead Plastic QFN (4mm × 5mm) (Reference LTC DWG # 05-08-1712 Rev C)-ren1
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LTC2323IUFD-16#TRPBF Details

  • Manufacturer Part Number:

    LTC2323IUFD-16#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    05-08-1712

  • ECCN Code:

    3A991.C.4

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    2.053 V

  • Analog Input Voltage-Min:

    -2.044 V

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PQCC-N28

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Linearity Error-Max (EL):

    0.0183%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    2

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.16X.2,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    5 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    18 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

LTC2323IUFD-16#TRPBF Frequently Asked Questions (FAQs)

  • Analog Devices provides a layout guide and recommendations for routing in the datasheet and application notes. It's essential to follow these guidelines to minimize noise and ensure optimal performance. Additionally, using a 4-layer PCB with a solid ground plane and separating analog and digital signals can help reduce noise and interference.
  • To prevent EMI, it's recommended to use a low-inductance path for the high-speed digital outputs, such as using a PCB trace with a low impedance and a short distance to the receiving device. Additionally, using a common-mode choke or a ferrite bead can help filter out high-frequency noise. It's also important to follow proper PCB design and layout practices, such as using a solid ground plane and separating analog and digital signals.
  • The maximum clock frequency for the LTC2323IUFD-16#TRPBF is 105 MSPS. The power consumption of the device increases with the clock frequency, so it's essential to consider the power budget and thermal management when operating at high clock frequencies. The datasheet provides a power consumption vs. clock frequency graph to help estimate the power consumption.
  • The LTC2323IUFD-16#TRPBF requires calibration and configuration for optimal performance. Analog Devices provides a calibration procedure in the datasheet and application notes. It's essential to follow these procedures and adjust the device's settings according to the specific application requirements. Additionally, using the device's built-in self-test and diagnostic features can help ensure proper calibration and configuration.
  • The LTC2323IUFD-16#TRPBF has a maximum junction temperature of 150°C. To prevent overheating, it's essential to provide adequate heat sinking and thermal management. This can be achieved by using a heat sink, thermal interface material, and ensuring good airflow around the device. The datasheet provides thermal resistance and power consumption data to help estimate the temperature rise and design a suitable thermal management system.

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LTC2323IUFD-16#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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