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LTC2326HMS-18#PBF - Analog Devices

Description: 18-Bit, 250ksps, ±10.24V True Bipolar, Pseudo-Differential Input ADC with 95dB SNR –16.5V to 16.5V –40°C to 125°C

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LTC2326HMS-18#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS Package 16-Lead Plastic MSOP
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LTC2326HMS-18#PBF - Analog Devices  - 3D model - Small Outline Packages - MS Package 16-Lead Plastic MSOP
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LTC2326HMS-18#PBF Details

  • Manufacturer Part Number:

    LTC2326HMS-18#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1669

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    10.2525 V

  • Analog Input Voltage-Min:

    -10.2275 V

  • Conversion Time-Max:

    3 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Linearity Error-Max (EL):

    0.0019%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    18

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.19

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    0.25 MHz

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    4.8 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

LTC2326HMS-18#PBF Frequently Asked Questions (FAQs)

  • The recommended layout and routing for the LTC2326HMS-18#PBF involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the analog signal traces. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and to avoid routing digital signals near the analog inputs.
  • To properly terminate the differential inputs of the LTC2326HMS-18#PBF, use a 100Ω differential termination resistor (RTERM) between the IN+ and IN- pins, and a 50Ω series resistor (RSERIES) on each input line. This will help to match the impedance of the input signals and prevent reflections.
  • The maximum sampling rate of the LTC2326HMS-18#PBF is 1.5Msps, and it can be achieved by setting the SCK frequency to 30MHz. However, increasing the sampling rate will also increase the power consumption, which can be estimated using the formula: Power (mW) = (VCC x ICC) + (fS x CLOAD x VCC^2), where fS is the sampling frequency, CLOAD is the load capacitance, and VCC is the supply voltage.
  • The LTC2326HMS-18#PBF requires a two-point calibration procedure to ensure accurate measurements. The recommended calibration procedure involves applying a known input voltage to the device and adjusting the offset and gain registers to achieve the desired output code. The calibration procedure should be performed at the operating temperature range of the device.
  • The LTC2326HMS-18#PBF has a maximum junction temperature (TJ) of 150°C, and it's recommended to keep the device temperature below 125°C for reliable operation. To ensure reliable operation, use a heat sink or a thermal pad to dissipate heat, and avoid exposing the device to high temperatures during storage or operation.

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LTC2326HMS-18#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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