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LTC2378IMS-20#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LTC2378IMS-20#PBF - Analogue to Digital Converter, 20 bit, 1 MSPS, Differential, Single Ended, SPI, Single, 2.375 V

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LTC2378IMS-20#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead Plastic MSOP
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LTC2378IMS-20#PBF - Analog Devices  - 3D model - Small Outline Packages - 16-Lead Plastic MSOP
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LTC2378IMS-20#PBF Details

  • Manufacturer Part Number:

    LTC2378IMS-20#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1669

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    5.1 V

  • Analog Input Voltage-Min:

    -2.5 V

  • Conversion Time-Max:

    0.675 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Linearity Error-Max (EL):

    0.0002%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    20

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.19

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    1 MHz

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC2378IMS-20#PBF Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the input and output traces short and away from each other. Additionally, use a low-ESR capacitor for the VCC pin and a 0.1uF capacitor for the REFIN pin.
  • To ensure accuracy, use a low-jitter clock source, keep the input signal bandwidth within the Nyquist frequency, and use a high-quality, low-noise reference voltage. Additionally, consider using a filter or a buffer amplifier to condition the input signal.
  • The recommended power-up sequence is to apply the analog supply voltage (VCC) first, followed by the digital supply voltage (DVCC), and then the clock signal. This ensures that the internal bias circuits are properly initialized.
  • To handle thermal management, ensure good airflow around the device, use a heat sink or thermal pad if necessary, and avoid blocking the thermal pads on the package. Additionally, consider using a thermally conductive material for the PCB.
  • To mitigate EMI and RFI, use a shielded enclosure, keep the device away from high-frequency sources, use a common-mode choke or ferrite bead on the input lines, and consider using a EMI filter or shielded cable for the clock input.

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LTC2378IMS-20#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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