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LTC2609IGN#PBF - Analog Devices

Description: IC DAC 16BIT V-OUT 16SSOP

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LTC2609IGN#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTC2609IGN#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - GN Package 16-Lead Plastic SSOP-ren1
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LTC2609IGN#PBF - Analog Devices - 3D model - Small Outline Packages - GN Package 16-Lead Plastic SSOP-ren1
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LTC2609IGN#PBF Details

  • Manufacturer Part Number:

    LTC2609IGN#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    LEAD FREE, PLASTIC, SSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1641 (GN16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Output Voltage-Max:

    5.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.8895 mm

  • Linearity Error-Max (EL):

    0.0977%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Settling Time-Nom (tstl):

    10 µs

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.899 mm

LTC2609IGN#PBF Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LTC2609IGN#PBF involves keeping the device away from high-frequency noise sources, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, the device should be placed in a way that minimizes the loop area of the input and output traces to reduce electromagnetic interference (EMI).
  • To ensure the LTC2609IGN#PBF is operating within its specified temperature range, it is recommended to provide adequate heat sinking and to keep the device away from high-temperature sources. The device's junction temperature (TJ) should be kept below 125°C, and the ambient temperature (TA) should be kept below 85°C. Thermal modeling and simulation can also be used to estimate the device's temperature and ensure it is operating within its specified range.
  • The recommended input and output capacitance for the LTC2609IGN#PBF depends on the specific application and the desired level of filtering. A general guideline is to use 10uF to 22uF ceramic capacitors for the input and output capacitors. The capacitor values should be chosen based on the desired cutoff frequency, and the capacitors should be placed close to the device to minimize parasitic inductance.
  • To troubleshoot issues with the LTC2609IGN#PBF, it is recommended to first check the device's input and output voltages, as well as the current consumption. The device's operating frequency and output waveform should also be checked using an oscilloscope. Common issues such as oscillations or instability can be caused by inadequate decoupling, incorrect component values, or poor layout and placement. The device's datasheet and application notes should be consulted for troubleshooting guidance.
  • The LTC2609IGN#PBF can be used in a high-reliability or high-availability application, but it requires careful consideration of the device's operating conditions, layout, and component selection. The device's reliability and availability can be improved by using redundant components, implementing error detection and correction mechanisms, and providing adequate heat sinking and cooling. The device's datasheet and application notes should be consulted for guidance on using the device in high-reliability or high-availability applications.

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LTC2609IGN#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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