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LTC2862HS8-2#PBF - Analog Devices

Description: ±60V Fault Protected 3V to 5.5V RS485/RS422 Transceivers

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LTC2862HS8-2#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S8 Package
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LTC2862HS8-2#PBF Details

  • Manufacturer Part Number:

    LTC2862HS8-2#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, LEAD FREE, PLASTIC, SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1610 (S8)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000005 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9025 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Low Current-Max:

    0.003 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    65 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.752 mm

  • Supply Current-Max:

    8 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1500 ns

  • Width:

    3.899 mm

LTC2862HS8-2#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2862HS8-2 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces connecting the IC to the power supply and load. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended capacitor selection and placement guidelines in the datasheet. Additionally, the output capacitor's ESR (Equivalent Series Resistance) should be within the recommended range, and the input capacitor should be placed close to the IC.
  • The maximum ambient temperature range for the LTC2862HS8-2 is -40°C to 125°C. However, the junction temperature (TJ) should not exceed 150°C to ensure reliable operation.
  • Yes, the LTC2862HS8-2 is suitable for high-reliability and aerospace applications. It is manufactured using a qualified process, and Analog Devices provides a range of reliability and quality data to support these applications.
  • To troubleshoot issues with the LTC2862HS8-2, start by verifying the PCB layout and component selection against the datasheet recommendations. Check for proper power supply decoupling, capacitor selection, and input/output filtering. Use an oscilloscope to analyze the output voltage and current waveforms, and consult the datasheet's troubleshooting section for guidance.

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LTC2862HS8-2#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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