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LTC2862IS8-1#TRPBF - Analog Devices

Description: Single Transmitter/Receiver RS-422/RS-485 Automotive 8-Pin SOIC N T/R

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LTC2862IS8-1#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead (150mil) Plastic SO
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LTC2862IS8-1#TRPBF - Analog Devices  - 3D model - Small Outline Packages - 8-Lead (150mil) Plastic SO
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LTC2862IS8-1#TRPBF Details

  • Manufacturer Part Number:

    LTC2862IS8-1#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, LEAD FREE, PLASTIC, SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1610 (S8)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000005 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9025 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Low Current-Max:

    0.003 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    65 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.752 mm

  • Supply Current-Max:

    1.3 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    50 ns

  • Width:

    3.899 mm

LTC2862IS8-1#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2862IS8-1 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the IC and the capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, the feedback resistors should be chosen to ensure a stable gain margin.
  • The maximum ambient temperature range for the LTC2862IS8-1 is -40°C to 125°C. However, the device can operate at a junction temperature of up to 150°C.
  • Yes, the LTC2862IS8-1 is suitable for high-reliability applications. It is manufactured using a high-reliability process and is screened to ensure high performance and low defect rates.
  • To troubleshoot issues with the LTC2862IS8-1, start by checking the power supply voltage, input and output voltages, and the feedback resistors. Use an oscilloscope to check for oscillations or noise on the output. Also, ensure that the PCB layout is correct and that the components are of high quality.

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LTC2862IS8-1#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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