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LTC3675EUFF#TRPBF - Analog Devices

Description: 7-Channel Configurable High Power PMIC

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LTC3675EUFF#TRPBF - Analog Devices - PCB symbol
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PCB Footprints
LTC3675EUFF#TRPBF - Analog Devices PCB footprint - Other - Other - UFF44MA 44-Lead Plastic QFN (4mm × 7mm)-2
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LTC3675EUFF#TRPBF - Analog Devices - 3D model - Other - UFF44MA 44-Lead Plastic QFN (4mm × 7mm)-2
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LTC3675EUFF#TRPBF Details

  • Manufacturer Part Number:

    LTC3675EUFF#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    4 X 7 MM, 0.75 MM HEIGHT, LEAD FREE, PLASTIC, QFN-44

  • Pin Count:

    44

  • Manufacturer Package Code:

    05-08-1762

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    R-PQCC-N44

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    7

  • Number of Functions:

    1

  • Number of Terminals:

    44

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC44,.16X.28,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

LTC3675EUFF#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC3675EUFF involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing the length of the traces between the IC and the capacitors. A 4-layer PCB with a dedicated power plane is recommended. Refer to the datasheet's layout guidelines and application notes for more details.
  • Choose input capacitors with low ESR (Equivalent Series Resistance) and high ripple current rating. Output capacitors should have low ESR, high capacitance, and be able to handle the output current. X5R or X7R ceramic capacitors are recommended. Refer to the datasheet's capacitor selection guidelines and application notes for more details.
  • The maximum ambient temperature for the LTC3675EUFF is 105°C. However, the junction temperature (TJ) should not exceed 125°C. Ensure proper thermal design and heat sinking to maintain a safe operating temperature.
  • Yes, the LTC3675EUFF is designed to operate in high-vibration environments. However, ensure that the PCB is properly secured and the components are properly soldered to prevent mechanical stress. Refer to the datasheet's mechanical stress guidelines for more details.
  • Start by checking the input voltage, output voltage, and current. Verify that the input and output capacitors are properly connected and meet the recommended specifications. Check for thermal issues, such as overheating or thermal shutdown. Refer to the datasheet's troubleshooting guidelines and application notes for more details.

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LTC3675EUFF#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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