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LTC4151CDD-1#PBF - Analog Devices

Description: Current & Power Monitors & Regulators 80V High-Side Power Monitor with Split SDA I/O

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LTC4151CDD-1#PBF - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - DD 10-Lead Plastic DFN (3mm × 3mm)
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LTC4151CDD-1#PBF - Analog Devices  - 3D model - Small Outline No-lead - DD 10-Lead Plastic DFN (3mm × 3mm)
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LTC4151CDD-1#PBF Details

  • Manufacturer Part Number:

    LTC4151CDD-1#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    3 X 3 MM, LEAD FREE, PLASTIC, MO-229WEED-2, DFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    05-08-1699

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    80 V

  • Supply Voltage-Min (Vsup):

    7 V

  • Supply Voltage-Nom (Vsup):

    48 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC4151CDD-1#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC4151CDD-1#PBF involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to use a separate analog and digital ground plane to reduce noise and interference.
  • The selection of input and output capacitors for the LTC4151CDD-1#PBF depends on the specific application requirements. In general, X5R or X7R ceramic capacitors with a voltage rating of 10V or higher are recommended for the input and output capacitors. The capacitance value should be chosen based on the desired output voltage ripple and transient response.
  • The LTC4151CDD-1#PBF has an operating ambient temperature range of -40°C to 125°C. However, the device's performance and reliability may be affected at extreme temperatures, so it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance.
  • The LTC4151CDD-1#PBF has a programmable output voltage feature that can be set using an external resistor divider network. The output voltage can be programmed by connecting a resistor divider network between the VOUT pin and the GND pin, and the desired output voltage can be calculated using the formula provided in the datasheet.
  • The LTC4151CDD-1#PBF has a maximum input voltage range of 36V. However, the device can operate with input voltages as low as 2.9V, making it suitable for a wide range of applications.

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LTC4151CDD-1#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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