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LTC4151IS-2#TRPBF - Analog Devices

Description: Power Supply Controller Power Supply Monitor, –40°C to 85°C, –0.3V to 90V,S PACKAGE 16-LEAD PLASTIC SO

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LTC4151IS-2#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S Package 16-Lead Plastic Small Outline
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LTC4151IS-2#TRPBF Details

  • Manufacturer Part Number:

    LTC4151IS-2#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, LEAD FREE, PLASTIC, SOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1610 (S16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.906 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.752 mm

  • Supply Voltage-Max (Vsup):

    80 V

  • Supply Voltage-Min (Vsup):

    7 V

  • Supply Voltage-Nom (Vsup):

    48 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.899 mm

LTC4151IS-2#TRPBF Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the LTC4151IS-2#TRPBF can be found in the LTC4151 demo board manual (DC2151A) available on the Analog Devices website. It provides a detailed layout guide for optimal performance and thermal management.
  • The sense resistor value depends on the maximum current and voltage of your application. A general guideline is to choose a sense resistor that results in a voltage drop of 10-50mV at the maximum current. You can use the formula Rsense = 0.01V / Imax to get an approximate value. Consult the datasheet and application notes for more information.
  • The LTC4151IS-2#TRPBF has an operating temperature range of -40°C to 125°C. However, the device's performance and accuracy may degrade at extreme temperatures. It's essential to consider the thermal management and heat dissipation in your design to ensure reliable operation.
  • The LTC4151IS-2#TRPBF is a surface-mount device and can be susceptible to vibration-induced failures. To ensure reliability in high-vibration environments, it's recommended to use a robust PCB design, secure the device with a suitable adhesive, and consider using a vibration-dampening material or potting compound.
  • To troubleshoot issues with the LTC4151IS-2#TRPBF, start by verifying the power supply voltage, sense resistor value, and PCB layout. Check for any signs of overheating, and ensure that the device is properly soldered and connected. Consult the datasheet, application notes, and Analog Devices' support resources for guidance on specific issues.

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LTC4151IS-2#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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