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LTC4310CDD-2#PBF - Analog Devices

Description: Digital Isolators I2C Isolator, 400kHz Max Bus Frequecy

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LTC4310CDD-2#PBF - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - DD 10-Lead Plastic DFN (3mm × 3mm)
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LTC4310CDD-2#PBF - Analog Devices  - 3D model - Small Outline No-lead - DD 10-Lead Plastic DFN (3mm × 3mm)
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LTC4310CDD-2#PBF Details

  • Manufacturer Part Number:

    LTC4310CDD-2#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    3 X 3 MM, LEAD FREE, PLASTIC, MO-229WEED-2, DFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    05-08-1699

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    HOT SWAP CONTROLLER

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC4310CDD-2#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC4310CDD-2#PBF involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the load. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • To ensure proper thermal management, it's recommended to provide a thermal pad on the PCB under the device, and to use a heat sink or a thermal interface material (TIM) to dissipate heat. The device's thermal pad should be connected to a solid ground plane to help dissipate heat.
  • The maximum capacitive load that the LTC4310CDD-2#PBF can drive is not explicitly stated in the datasheet, but it's generally recommended to limit the capacitive load to 10nF or less to ensure stability and prevent oscillations.
  • The LTC4310CDD-2#PBF is rated for operation up to 125°C, but it's recommended to derate the device's performance and consider the effects of temperature on the device's parameters, such as output voltage and current, when operating in high-temperature environments.
  • To troubleshoot issues with the LTC4310CDD-2#PBF, start by checking the device's input and output voltages, and ensuring that the device is properly powered and configured. Check for any signs of overheating, and verify that the device is properly thermally managed. Use an oscilloscope to check for oscillations or noise on the output, and consult the datasheet and application notes for guidance on troubleshooting specific issues.

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LTC4310CDD-2#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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