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LTC5583IUF#PBF - Analog Devices

Description: UF Package 24-Lead Plastic QFN (4mm × 4mm)

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LTC5583IUF#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTC5583IUF#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UF Package 24-Lead Plastic QFN(4mm × 4mm)
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LTC5583IUF#PBF - Analog Devices - 3D model - Quad Flat No-Lead - UF Package 24-Lead Plastic QFN(4mm × 4mm)
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LTC5583IUF#PBF Details

  • Manufacturer Part Number:

    LTC5583IUF#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    24

  • Manufacturer Package Code:

    05-08-1697

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    POWER SUPPLY SUPPORT CIRCUIT

  • JESD-30 Code:

    S-PQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    3.5 V

  • Supply Voltage-Min (Vsup):

    3.1 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

LTC5583IUF#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC5583 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the device close to the antenna. A 4-layer PCB with a dedicated ground plane is recommended.
  • The choice of external components such as capacitors, inductors, and resistors depends on the specific application and frequency of operation. Refer to the datasheet for recommended component values and consider factors such as component tolerance, parasitic effects, and thermal considerations.
  • The maximum power handling capability of the LTC5583 is dependent on the specific application and operating conditions. However, as a general guideline, the device can handle up to 20 dBm of input power. Exceeding this limit may result in reduced performance or damage to the device.
  • Common issues with the LTC5583 can often be attributed to poor PCB layout, incorrect component selection, or inadequate filtering. Troubleshooting involves checking the PCB layout, verifying component values, and ensuring proper filtering and impedance matching.
  • Yes, the LTC5583 can be used in a differential configuration to improve common-mode rejection and reduce noise. However, this requires careful attention to layout and component selection to maintain symmetry and minimize common-mode errors.

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LTC5583IUF#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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