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LTC6655CHMS8-1.25#PBF - Analog Devices

Description: Voltage References Ultra Low Noise, 1.25V Precision Voltage Reference

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LTC6655CHMS8-1.25#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8 8-Lead Plastic MSOP
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LTC6655CHMS8-1.25#PBF Details

  • Manufacturer Part Number:

    LTC6655CHMS8-1.25#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    1.2506 V

  • Output Voltage-Min:

    1.2493 V

  • Output Voltage-Nom:

    1.25 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    7.5 mA

  • Supply Voltage-Max (Vsup):

    13.2 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temp Coef of Voltage-Max:

    5 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    0.05%

  • Width:

    3 mm

LTC6655CHMS8-1.25#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC6655CHMS8-1.25#PBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • To ensure proper bypassing, place a 10uF ceramic capacitor between the VCC pin and the GND pin, and a 100nF ceramic capacitor between the VCC pin and the GND pin. This will help to filter out high-frequency noise and ensure stable operation.
  • The maximum operating temperature range for the LTC6655CHMS8-1.25#PBF is -40°C to 125°C. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • No, the LTC6655CHMS8-1.25#PBF is not a radiation-hardened device and is not suitable for use in high-radiation environments. If you need a radiation-hardened voltage reference, you should consider a different device specifically designed for that purpose.
  • To troubleshoot issues with the LTC6655CHMS8-1.25#PBF, start by checking the power supply voltage, ensuring it's within the recommended range. Next, verify that the device is properly bypassed and that the PCB layout is correct. If the issue persists, check for noise or EMI interference and ensure that the device is operated within its recommended temperature range.

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LTC6655CHMS8-1.25#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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