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LTC6803HG-3#TRPBF - Analog Devices

Description: 12 Channel Multicell Battery Monitor with Daisy Chain Interface, Generation 2

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PCB Footprints
LTC6803HG-3#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - G Package 44-Lead Plastic SSOP (5.3mm) (Reference LTC DWG # 05-08-1754 Rev Ø)
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3D Models
LTC6803HG-3#TRPBF - Analog Devices  - 3D model - Small Outline Packages - G Package 44-Lead Plastic SSOP (5.3mm) (Reference LTC DWG # 05-08-1754 Rev Ø)
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LTC6803HG-3#TRPBF Details

  • Manufacturer Part Number:

    LTC6803HG-3#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    5.30 MM, LEAD FREE, PLASTIC, SSOP-44

  • Pin Count:

    44

  • Manufacturer Package Code:

    05-08-1754

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    BATTERY MONITOR

  • JESD-30 Code:

    R-PDSO-G44

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    44

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max (Vsup):

    55 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    43.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    5.3 mm

LTC6803HG-3#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC6803HG-3#TRPBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the battery pack. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and ensure accurate measurements.
  • Calibration of the LTC6803HG-3#TRPBF involves adjusting the internal voltage reference and temperature sensor offsets. This can be done using the device's built-in calibration registers or through external calibration using a precision voltage source and a thermocouple. Refer to the datasheet and application notes for detailed calibration procedures.
  • Up to 256 LTC6803HG-3#TRPBF devices can be daisy-chained together using the device's SPI interface, allowing for the monitoring of large battery packs with multiple cells.
  • The LTC6803HG-3#TRPBF is specified to operate from -40°C to 125°C. Ensure that the device is properly heatsinked and that the PCB is designed to dissipate heat effectively. Additionally, consider using thermal management techniques such as thermal interfaces and heat sinks to keep the device within its specified temperature range.
  • The recommended power-up sequence for the LTC6803HG-3#TRPBF is to first apply the analog supply voltage (VCC), followed by the digital supply voltage (VDD). This ensures that the device's internal voltage regulators are properly powered up and that the device is configured correctly.

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LTC6803HG-3#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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