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LTC6811HG-1#TRPBF - Analog Devices

Description: 12 Channel Multicell Battery Monitor with Daisy Chain Interface, Generation 4

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LTC6811HG-1#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 48-Lead Plastic SSssOP (5.3mm
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LTC6811HG-1#TRPBF - Analog Devices - 3D model - Small Outline Packages - 48-Lead Plastic SSssOP (5.3mm
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LTC6811HG-1#TRPBF Details

  • Manufacturer Part Number:

    LTC6811HG-1#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    05-08-1887

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    BATTERY MONITOR

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max (Vsup):

    55 V

  • Supply Voltage-Min (Vsup):

    11 V

  • Supply Voltage-Nom (Vsup):

    40 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    5.3 mm

LTC6811HG-1#TRPBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate analog ground plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a star topology for the power supply connections and keep the sense lines short and shielded.
  • Calibration involves adjusting the gain and offset of the ADCs. Use the datasheet's calibration procedure, which involves applying known voltages and temperatures to the inputs and adjusting the internal registers accordingly. You can also use the LTC6811's built-in self-test feature to verify the calibration.
  • Up to 12 LTC6811HG-1#TRPBF devices can be connected in a daisy-chain configuration using the SPI interface. However, the maximum number of devices may be limited by the system's noise tolerance and the quality of the PCB layout.
  • Ensure good airflow around the device, and avoid blocking the airflow with components or PCB features. Use thermal vias and thermal pads to dissipate heat from the device. Operate the device within the specified temperature range of -40°C to 125°C.
  • Power up the device in the following sequence: VCC, VIO, and then the SPI clock. Ensure that the power supplies are stable and within the specified voltage range before applying the clock signal.

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LTC6811HG-1#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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