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LTM2882HY-3#PBF - Analog Devices

Description: RS-232 Interface IC Complete Isolated RS232 uModule Transceiver + Power

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PCB Footprints
LTM2882HY-3#PBF - Analog Devices PCB footprint - BGA - BGA - 32-Lead (15mm x 11.25mm x 3.42mm)
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LTM2882HY-3#PBF - Analog Devices  - 3D model - BGA - 32-Lead (15mm x 11.25mm x 3.42mm)
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LTM2882HY-3#PBF Details

  • Manufacturer Part Number:

    LTM2882HY-3#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    05-08-1851

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Differential Output:

    NO

  • Driver Number of Bits:

    2

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232-F; TIA-232-F

  • JESD-30 Code:

    R-PBGA-B32

  • Length:

    15 mm

  • Number of Functions:

    2

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA32,8X11,50

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Receive Delay-Max:

    400 ns

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    3.62 mm

  • Supply Current-Max:

    30 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transmit Delay-Max:

    500 ns

  • Width:

    11.25 mm

LTM2882HY-3#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTM2882HY-3 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals, and to minimize the length of the traces carrying high-frequency signals.
  • To ensure proper powering and decoupling of the LTM2882HY-3, use a high-quality power supply with low noise and ripple, and decouple the device with a 10uF ceramic capacitor and a 1uF ceramic capacitor in parallel, placed as close as possible to the device's power pins.
  • The maximum cable length supported by the LTM2882HY-3 depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths of up to 10 meters for USB signals and up to 100 meters for RS-485 signals, assuming a good quality cable with proper shielding and termination.
  • The LTM2882HY-3 can be configured for a specific application by setting the appropriate registers and pins. Refer to the device's datasheet and application notes for specific configuration guidelines, and use the Analog Devices' evaluation board and software tools to simplify the configuration process.
  • The LTM2882HY-3 has a maximum junction temperature of 125°C, and it's recommended to keep the device's temperature below 85°C for optimal performance and reliability. Ensure good airflow around the device, and consider using a heat sink or thermal pad if the device is expected to operate in a high-temperature environment.

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LTM2882HY-3#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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