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MAX13003EEUE+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX13003EEUE+ - Low-Voltage Level Translator, 6 Input, 20 ns, 1.5 V to 3.6 V, TSSOP-16

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MAX13003EEUE+ - Analog Devices - PCB symbol
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PCB Footprints
MAX13003EEUE+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - U16+2
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3D Models
MAX13003EEUE+ - Analog Devices - 3D model - Small Outline Packages - U16+2
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MAX13003EEUE+ Details

  • Manufacturer Part Number:

    MAX13003EEUE+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-TSSOP_4.4-4.4_MM

  • Package Description:

    ROHS COMPLIANT, TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-TSSOP_4.4-4.4_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2005-07-05

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.5 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MAX13003EEUE+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX13003EEUE+ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling between the analog and digital sections. A 4-layer PCB with a dedicated analog ground plane is recommended. Additionally, the device's exposed pad should be connected to a solid ground plane to improve thermal performance.
  • To ensure proper power-up and configuration, follow the recommended power-up sequence: VCC, then VDD, and finally the digital inputs. The device should be powered up with a single 3.3V or 5V supply, and the VCC pin should be decoupled with a 0.1uF capacitor. The device's configuration pins (e.g., ADDR, CS) should be tied to the desired logic level during power-up.
  • The MAX13003EEUE+ has a maximum data transfer rate of 20Mbps in SPI mode and 10Mbps in I2C mode. However, the actual data transfer rate may be limited by the system's clock frequency, bus capacitance, and other factors.
  • The MAX13003EEUE+ has a maximum junction temperature of 150°C. To ensure reliable operation, the device's thermal pad should be connected to a solid ground plane, and the PCB should be designed to dissipate heat efficiently. A thermal pad size of at least 1.5mm x 1.5mm is recommended, and the device should be placed in a location with good airflow.
  • The MAX13003EEUE+ has built-in ESD protection on its digital inputs, but it is still important to follow proper ESD handling procedures during device handling and PCB assembly. The device's ESD protection is rated to ±2kV human body model (HBM) and ±200V machine model (MM).

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MAX13003EEUE+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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