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MAX13054ASA+ - Analog Devices

Description: CAN Transceiver 1 Mbit/s ISO 11898 Standby-Mode 8pins SOIC

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MAX13054ASA+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 8 SO-3
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MAX13054ASA+ - Analog Devices  - 3D model - Small Outline Packages - 8 SO-3
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MAX13054ASA+ Details

  • Manufacturer Part Number:

    MAX13054ASA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOIC_N-150_MIL

  • Package Description:

    0.150 INCH, ROHS COMPLIANT, MS-012AA, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOIC_N-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2005-02-24

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Data Rate:

    1000 Mbps

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX13054ASA+ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX13054ASA+ involves keeping the device away from high-current carrying traces, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog ground plane to minimize noise and ensure optimal performance.
  • To ensure the MAX13054ASA+ is properly powered and decoupled, use a high-quality power supply with low noise and ripple, and decouple the device with a 10uF ceramic capacitor and a 100nF ceramic capacitor in parallel, placed as close as possible to the device's power pins.
  • The MAX13054ASA+ has an operating temperature range of -40°C to +125°C, but it's recommended to operate the device within a temperature range of -20°C to +85°C for optimal performance and reliability.
  • To troubleshoot issues with the MAX13054ASA+, start by checking the power supply and decoupling, then verify the device's configuration and programming. Use an oscilloscope to check the device's output signals and verify that they meet the expected specifications. If issues persist, consult the datasheet and application notes, or contact Analog Devices Inc's technical support.
  • The MAX13054ASA+ is a high-reliability device, but it's essential to follow proper design and manufacturing guidelines to ensure the device meets the required safety and reliability standards. Consult the datasheet and application notes, and contact Analog Devices Inc's technical support for guidance on using the device in high-reliability or safety-critical applications.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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