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MAX14879AWE+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX14879AWE+ - CAN TRANSCEIVER, 1MBPS, WSOIC-16

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MAX14879AWE+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 21-0042 J
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MAX14879AWE+ Details

  • Manufacturer Part Number:

    MAX14879AWE+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-SOIC_W-300_MIL

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-SOIC_W-300_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2017-10-19

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Data Rate:

    1000 Mbps

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    0.83 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    CAN TRANSCEIVER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

MAX14879AWE+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX14879AWE+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals, and to minimize the length of the traces between the device and the power supply.
  • To ensure proper power-up and configuration, make sure to follow the recommended power-up sequence, which involves applying the power supply voltage (VCC) before the input voltage (VIN). Also, ensure that the EN pin is pulled high to enable the device, and the RST pin is pulled low to reset the device. Finally, configure the device using the SPI interface according to the datasheet.
  • The MAX14879AWE+ can handle a maximum current of 1A per channel, with a total current limit of 2A for both channels combined. However, it's recommended to derate the current based on the ambient temperature and the PCB layout to ensure reliable operation.
  • To troubleshoot issues with the MAX14879AWE+, start by checking the power supply voltage and ensuring that it's within the recommended range. Then, verify that the device is properly configured using the SPI interface. If the issue persists, check the input and output voltages, and ensure that the device is not overheating. Finally, consult the datasheet and application notes for troubleshooting guidelines and FAQs.
  • The MAX14879AWE+ is rated for operation up to 125°C, but it's recommended to derate the current and voltage based on the ambient temperature to ensure reliable operation. Additionally, ensure that the device is properly heatsinked and that the PCB layout is designed to dissipate heat efficiently.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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