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MAX253CSA+T - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX253CSA+T - Transformer Driver, 2.5 V to 6 V in, NSOIC-8

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MAX253CSA+T - Analog Devices - PCB symbol
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PCB Footprints
MAX253CSA+T - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S8+4
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3D Models
MAX253CSA+T - Analog Devices - 3D model - Small Outline Packages - S8+4
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MAX253CSA+T Details

  • Manufacturer Part Number:

    MAX253CSA+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOIC_N-150_MIL

  • Package Description:

    0.150 INCH, SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOIC_N-150_MIL

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    1994-01-01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX253CSA+T Frequently Asked Questions (FAQs)

  • A good PCB layout practice for the MAX253CSA+T is to keep the input and output traces separate, use a solid ground plane, and place the device close to the power source. Additionally, use a ferrite bead or a pi-filter to filter out high-frequency noise on the power lines.
  • To ensure proper power-up and initialization, make sure to follow the power-up sequence specified in the datasheet, which is VCC first, then VEE. Also, ensure that the input voltage is within the recommended range, and the device is properly decoupled with capacitors.
  • The MAX253CSA+T has an operating temperature range of -40°C to +125°C. However, it's recommended to operate the device within a temperature range of -20°C to +85°C for optimal performance and reliability.
  • Yes, the MAX253CSA+T is designed to operate in high-vibration environments. However, it's recommended to follow proper mounting and soldering techniques to ensure the device is securely attached to the PCB. Additionally, consider using a vibration-resistant capacitor and ensuring the PCB is properly secured to the system.
  • To troubleshoot issues with the MAX253CSA+T, start by checking the power supply voltage, input voltage, and output voltage using an oscilloscope or multimeter. Verify that the device is properly powered up and initialized. Check for any signs of overheating, and ensure that the device is properly decoupled. If the issue persists, consult the datasheet and application notes for troubleshooting guidelines.

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MAX253CSA+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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