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MAX32660GWE+T - Analog Devices

Description: 16 BUMPS WLP PKG. 0.35 mm PITCH,W161K1+1 Tiny, Ultra-Low-Power Arm Cortex-M4 Processor with FPU-Based Microcontroller (MCU) with 256KB Flash and 96KB SRAM

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MAX32660GWE+T - Analog Devices - PCB symbol
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PCB Footprints
MAX32660GWE+T - Analog Devices PCB footprint - BGA - BGA - W161K1+1
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3D Models
MAX32660GWE+T - Analog Devices - 3D model - BGA - W161K1+1
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MAX32660GWE+T Details

  • Manufacturer Part Number:

    MAX32660GWE+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-WLCSP-N/A

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Date Of Intro:

    2018-03-15

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Has ADC:

    NO

  • Bit Size:

    32

  • Clock Frequency-Max:

    98.5 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Length:

    1.6 mm

  • Moisture Sensitivity Level:

    1

  • Number of I/O Lines:

    10

  • Number of Terminals:

    16

  • PWM Channels:

    YES

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Speed:

    96 MHz

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MAX32660GWE+T Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the MAX32660GWE+T can be found in the MAX32660 Evaluation Kit User Guide (UG1391) and the MAX32660 PCB Layout Guidelines (PDF) available on the Analog Devices website.
  • To optimize power consumption, use the Power Mode Controller (PMC) to dynamically adjust the clock frequency and voltage based on the system's requirements. Additionally, use the Low-Power Modes (LPM) and Dynamic Voltage and Frequency Scaling (DVFS) to reduce power consumption when the system is idle or in low-power states.
  • The maximum operating temperature range for the MAX32660GWE+T is -40°C to +85°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -20°C to +70°C for optimal performance and reliability.
  • The MAX32660GWE+T has a built-in Secure Boot mechanism that ensures the authenticity and integrity of the firmware. For firmware updates, use the MAX32660's built-in bootloader and follow the guidelines provided in the MAX32660 Firmware Update Application Note (AN5411) available on the Analog Devices website.
  • The recommended decoupling capacitors for the MAX32660GWE+T are 1uF and 10nF capacitors, as specified in the datasheet. These capacitors should be placed close to the power pins and grounded to the PCB's ground plane to ensure proper power supply decoupling.

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MAX32660GWE+T Overview

Use the download button to access the MAX32660GWE+T schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MAX32, or try a keyword search, such as Microcontrollers

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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