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MAX44252ASD+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX44252ASD+ - Operational Amplifier, Rail to Rail Output, Ultra Precision, 4 Amplifier, 10 MHz, 8 V/µs

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MAX44252ASD+ - Analog Devices - PCB symbol
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MAX44252ASD+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 14-Pin SOIC
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MAX44252ASD+ - Analog Devices - 3D model - Small Outline Packages - 14-Pin SOIC
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MAX44252ASD+ Details

  • Manufacturer Part Number:

    MAX44252ASD+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    14-SOIC_N-150_MIL

  • Pin Count:

    14

  • Manufacturer Package Code:

    14-SOIC_N-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2011-10-24

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0012 µA

  • Bias Current-Max (IIB) @25C:

    0.0013 µA

  • Common-mode Reject Ratio-Nom:

    129 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    6.5 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    5 V/us

  • Supply Current-Max:

    7 mA

  • Supply Voltage Limit-Max:

    22 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    10000

  • Voltage Gain-Min:

    4466840

  • Wideband:

    NO

  • Width:

    3.9 mm

MAX44252ASD+ Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow a 4-layer PCB stackup with a solid ground plane, keep the input and output traces short and symmetrical, and use a common-mode choke or ferrite bead to filter out high-frequency noise. Additionally, ensure that the device is placed close to the power source and decoupling capacitors are used to minimize voltage drops.
  • To select the correct output voltage and current, consider the requirements of your load device, such as the voltage and current ratings, and the desired output voltage range. The MAX44252ASD+ has an adjustable output voltage range of 0.8V to 5.5V, and a maximum output current of 2A. Use the datasheet's equations and graphs to determine the optimal output voltage and current settings for your application.
  • The EN (enable) pin is used to enable or disable the output voltage of the MAX44252ASD+. When the EN pin is pulled high (logic level 1), the output voltage is enabled, and when it's pulled low (logic level 0), the output voltage is disabled. This pin can be used to implement power sequencing, shutdown, or low-power modes in your system.
  • The MAX44252ASD+ has a thermal pad on the bottom of the package, which should be connected to a solid ground plane or a thermal relief pattern on the PCB to dissipate heat. Ensure good airflow around the device, and consider using a heat sink or thermal interface material if the device is expected to operate in high-temperature environments or with high-power loads.
  • To minimize electromagnetic interference (EMI) and ensure electromagnetic compatibility (EMC), follow proper PCB layout and design guidelines, such as using a solid ground plane, minimizing loop areas, and using shielding or filtering components. Additionally, ensure that the device is placed in a shielded enclosure or uses a metal casing to reduce radiated emissions.

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MAX44252ASD+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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