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MAX5472EZT+T - Analog Devices

Description: 32-Tap, Nonvolatile, Linear-Taper Digital Potentiometers in SOT23

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MAX5472EZT+T - Analog Devices PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - MAX5472EZT+T
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MAX5472EZT+T - Analog Devices  - 3D model - SOT23 (6-Pin) - MAX5472EZT+T
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MAX5472EZT+T Details

  • Manufacturer Part Number:

    MAX5472EZT+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    6-TSOT-N/A

  • Package Description:

    TSSOP,

  • Pin Count:

    6

  • Manufacturer Package Code:

    6-TSOT-N/A

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2003-11-12

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    NONVOLATILE MEMORY

  • Bandwidth-Nom:

    0.2 kHz

  • Control Interface:

    INCREMENT/DECREMENT

  • Converter Type:

    DIGITAL POTENTIOMETER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Positions:

    32

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Resistance Law:

    LINEAR

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Coefficient-Nom:

    35 ppm/°C

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Total Resistance-Nom:

    100000 Ω

  • Width:

    1.6 mm

MAX5472EZT+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX5472EZT+T involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a low-ESR capacitor for the output filter and to keep the input and output traces as short as possible.
  • To ensure stability, make sure to follow the recommended output capacitor values and ESR ranges, and avoid using capacitors with high ESL. Also, ensure that the input voltage is within the recommended range, and the device is operated within the specified temperature range.
  • The MAX5472EZT+T can handle input voltages up to 5.5V, but it's recommended to operate it within the specified range of 2.7V to 5.5V for optimal performance and reliability.
  • The MAX5472EZT+T is rated for operation up to 125°C, but it's recommended to derate the output current and voltage as the temperature increases to ensure reliability and prevent overheating.
  • To troubleshoot issues with the MAX5472EZT+T, start by checking the input voltage, output load, and PCB layout. Verify that the device is operated within the specified temperature range and that the output capacitor values and ESR are within the recommended ranges. Use an oscilloscope to measure the output voltage and current, and check for any signs of oscillation or instability.

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MAX5472EZT+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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