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MAX5590BEUG+ - Analog Devices

Description: Digital to Analog Converters - DAC Buffered, Fast-Settling, Octal, 12/10/8-Bit, Voltage-Output DACs

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MAX5590BEUG+ - Analog Devices - PCB symbol
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PCB Footprints
MAX5590BEUG+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - U24+1
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3D Models
MAX5590BEUG+ - Analog Devices - 3D model - Small Outline Packages - U24+1
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MAX5590BEUG+ Details

  • Manufacturer Part Number:

    MAX5590BEUG+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    24-TSSOP_4.4-4.4_MM

  • Package Description:

    TSSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    24-TSSOP_4.4-4.4_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.40

  • Date Of Intro:

    2003-11-12

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    5.25 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    7.8 mm

  • Linearity Error-Max (EL):

    0.0977%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    6 µs

  • Settling Time-Nom (tstl):

    3 µs

  • Supply Current-Max:

    8 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MAX5590BEUG+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX5590BEUG+ involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended. Additionally, it's essential to follow the layout guidelines provided in the datasheet and application notes.
  • To ensure proper power-up and initialization, make sure to follow the power-up sequence specified in the datasheet. Apply the power supply to the device in the correct order (VCC, then VLOGIC), and ensure that the input voltage is within the recommended range. Also, ensure that the EN pin is properly biased to enable the device. It's also recommended to add a power-on reset circuit to ensure the device is properly initialized.
  • The MAX5590BEUG+ can drive capacitive loads up to 100nF. However, it's recommended to limit the capacitive load to 10nF or less to ensure stable operation and prevent oscillations. If a larger capacitive load is required, it's recommended to add a series resistor to limit the current and prevent damage to the device.
  • To troubleshoot issues with the MAX5590BEUG+, start by verifying the power supply and input voltage levels. Check for proper termination and loading of the output stages. Use an oscilloscope to monitor the output waveforms and look for signs of oscillation or instability. Also, check the device's thermal performance and ensure that it's operating within the recommended temperature range. If the issue persists, consult the datasheet and application notes for troubleshooting guidelines or contact Analog Devices' technical support.
  • The MAX5590BEUG+ is rated for operation up to 125°C. However, it's essential to ensure that the device is properly heatsinked and that the thermal design is adequate to prevent overheating. Consult the datasheet and thermal design guidelines to ensure that the device is operated within its recommended temperature range.

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MAX5590BEUG+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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