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MAX5977AETP+ - Analog Devices

Description: 1V to 16V, Single-Channel, Hot-Swap Controllers with Precision Current-Sensing Output

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PCB Footprints
MAX5977AETP+ - Analog Devices PCB footprint - Other - Other - QFN50P400X400X80-21N
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3D Models
MAX5977AETP+ - Analog Devices  - 3D model - Other - QFN50P400X400X80-21N
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MAX5977AETP+ Details

  • Manufacturer Part Number:

    MAX5977AETP+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    20-LFCSP-4X4X0.75

  • Package Description:

    TQFN-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    20-LFCSP-4X4X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2010-10-19

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    HOT SWAP CONTROLLER

  • JESD-30 Code:

    S-XQCC-N20

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    4 mA

  • Supply Voltage-Max (Vsup):

    16 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

MAX5977AETP+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX5977AETP+ involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended. Additionally, it's essential to follow the layout guidelines provided in the datasheet and application notes.
  • To ensure proper power-up and initialization, make sure to follow the power-up sequence specified in the datasheet. Apply the power supply to the device in the correct order (VCC, then VIN), and ensure that the input voltage is within the recommended range. Also, make sure to add a 10nF decoupling capacitor between the VCC pin and the GND pin, and a 100nF decoupling capacitor between the VIN pin and the GND pin.
  • The maximum output current capability of the MAX5977AETP+ is 1A. However, it's essential to consider the thermal limitations of the device and the PCB layout when designing the system. The device can operate at high temperatures, but excessive current can lead to thermal shutdown or damage.
  • To troubleshoot issues with the MAX5977AETP+, start by verifying the input voltage and power supply connections. Check for any signs of overheating, such as excessive temperature or thermal shutdown. Use an oscilloscope to monitor the output voltage and current, and verify that the device is operating within the recommended specifications. Consult the datasheet and application notes for troubleshooting guidelines and common pitfalls to avoid.
  • The MAX5977AETP+ is rated for operation up to 125°C. However, it's essential to consider the thermal limitations of the device and the PCB layout when designing the system. Ensure that the device is properly heatsinked, and consider using thermal interface materials to improve heat dissipation. Consult the datasheet and application notes for thermal management guidelines.

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MAX5977AETP+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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