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MAX6643LBBAEE+T - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX6643LBBAEE+T - PWM Controller, Overtemperature Output, 3V to 5.5V Supply, 32Hz, QSOP-16

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MAX6643LBBAEE+T - Analog Devices - PCB symbol
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MAX6643LBBAEE+T - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - E16+1
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MAX6643LBBAEE+T - Analog Devices - 3D model - Small Outline Packages - E16+1
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MAX6643LBBAEE+T Details

  • Manufacturer Part Number:

    MAX6643LBBAEE+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-QSOP-150_MIL

  • Package Description:

    SSOP, SSOP16,.25

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-QSOP-150_MIL

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2004-05-28

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    0.5 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX6643LBBAEE+T Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to have a solid ground plane underneath the device, and to use thermal vias to connect the exposed pad to the ground plane. Additionally, keep the PCB traces as short and wide as possible to minimize thermal resistance.
  • The MAX6643LBBAEE+T has an internal calibration, so no external calibration is required. However, if you need to calibrate the sensor for high accuracy, you can use an external calibration resistor and follow the calibration procedure outlined in the application note AN4341.
  • The maximum junction temperature that the MAX6643LBBAEE+T can withstand is 150°C. However, it is recommended to operate the device at a junction temperature below 125°C for optimal reliability and performance.
  • Yes, the MAX6643LBBAEE+T is designed to withstand high-vibration environments. However, it is recommended to follow proper PCB mounting and soldering techniques to ensure that the device is securely attached to the PCB and can withstand the vibration.
  • The thermal shutdown feature is enabled by default and will shut down the device when the junction temperature exceeds 150°C. To handle this feature, you can use an external reset circuit to reset the device when it comes out of thermal shutdown, or use a microcontroller to monitor the thermal shutdown signal and take appropriate action.

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MAX6643LBBAEE+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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