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MAX6818EAP+ - Analog Devices

Description: MAX6818EAP+, Bounce Eliminator Circuit CMOS, 8-channel 20-Pin SSOP 5.5 V 2.7 V

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MAX6818EAP+ - Analog Devices - PCB symbol
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MAX6818EAP+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 20 SSOP
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MAX6818EAP+ - Analog Devices - 3D model - Small Outline Packages - 20 SSOP
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MAX6818EAP+ Details

  • Manufacturer Part Number:

    MAX6818EAP+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    20-SSOP-5.3_MM

  • Package Description:

    5.30 X 6.50 MM, SSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    20-SSOP-5.3_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    1999-01-03

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    7.2 mm

  • Logic IC Type:

    LOGIC CIRCUIT

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP20,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.99 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.29 mm

MAX6818EAP+ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX6818EAP+ involves keeping the device away from high-current carrying traces, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • To ensure stability, it's essential to follow the recommended component values and layout guidelines. Additionally, make sure to decouple the input and output with suitable capacitors, and use a low-ESR output capacitor. Also, avoid using long traces and minimize the loop area of the feedback network to prevent oscillation.
  • The MAX6818EAP+ can handle input voltages up to 40V, but it's recommended to operate within the specified input voltage range of 4.5V to 36V for optimal performance and reliability.
  • The MAX6818EAP+ is rated for operation up to 125°C, but it's essential to consider the derating of the device's performance and reliability at high temperatures. Make sure to follow the recommended operating conditions and thermal management guidelines to ensure reliable operation.
  • To troubleshoot issues with the MAX6818EAP+, start by checking the input and output voltages, and ensure that the device is properly powered and configured. Use an oscilloscope to check for oscillations, and verify that the feedback network is properly connected. Also, check for any signs of overheating, and ensure that the device is properly cooled.

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MAX6818EAP+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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