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MAX706TESA+ - Analog Devices

Description: MAX706TESA+, Voltage Supervisor 3 → 3.15 V Active Low, Push-Pull, reset 8-Pin SOIC

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MAX706TESA+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S8+2
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MAX706TESA+ - Analog Devices  - 3D model - Small Outline Packages - S8+2
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MAX706TESA+ Details

  • Manufacturer Part Number:

    MAX706TESA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOIC_N-150_MIL

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOIC_N-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    1999-05-28

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:Y;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:Y;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    0.5 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3.08V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX706TESA+ Frequently Asked Questions (FAQs)

  • The MAX706TESA+ requires careful layout and placement to ensure proper operation. It's recommended to follow the layout guidelines provided in the datasheet, including keeping the input and output pins away from each other, using a solid ground plane, and minimizing trace lengths and widths.
  • To minimize high-frequency noise and EMI, use proper shielding, grounding, and decoupling techniques. Add bypass capacitors between the power supply pins and ground, and consider using a ferrite bead or common-mode choke to filter out high-frequency noise.
  • The MAX706TESA+ is rated for operation from -40°C to +125°C. However, it's essential to consider the thermal management and heat dissipation in your design to ensure reliable operation within this temperature range.
  • Yes, the MAX706TESA+ is suitable for battery-powered devices due to its low quiescent current (IQ) of 1.5mA. However, consider the power consumption and battery life requirements in your design to ensure optimal performance.
  • The MAX706TESA+ has a programmable output voltage range from 1.25V to 5.5V. To program the output voltage, use the VSET pin and an external resistor divider network. Refer to the datasheet for the calculation formula and example circuits.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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