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MAX78000EXG+ - Analog Devices

Description: Artificial Intelligence Microcontroller with Ultra-Low-Power Convolutional Neural Network Accelerator

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MAX78000EXG+ - Analog Devices - PCB symbol
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PCB Footprints
MAX78000EXG+ - Analog Devices PCB footprint - BGA - BGA - 81-CSP_BGA-8X8X1.17
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3D Models
MAX78000EXG+ - Analog Devices - 3D model - BGA - 81-CSP_BGA-8X8X1.17
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MAX78000EXG+ Details

  • Manufacturer Part Number:

    MAX78000EXG+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    81-CSP_BGA-8X8X1.17

  • Package Description:

    CTBGA-81

  • Pin Count:

    81

  • Manufacturer Package Code:

    81-CSP_BGA-8X8X1.17

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.31.00.30

  • Date Of Intro:

    2020-08-19

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B81

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    81

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA81,9X9,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.3 mm

  • Supply Voltage-Max:

    1.21 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    8 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MAX78000EXG+ Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the MAX78000EXG+. Ensure a solid ground plane, keep analog and digital signals separate, and use short traces for sensitive signals. Refer to the MAX78000 Evaluation Kit's PCB layout as a reference.
  • To avoid latch-up and ensure proper power-up, follow this sequence: 1) Power up VDD, 2) Power up VDDIO, 3) Apply a valid clock signal, and 4) Bring EN high. This sequence helps prevent unwanted behavior and ensures a stable startup.
  • The MAX78000EXG+ can support clock frequencies up to 133 MHz. However, the actual frequency limit may depend on the specific application, PCB layout, and signal integrity. It's recommended to consult the datasheet and perform thorough testing to determine the maximum clock frequency for your specific use case.
  • The MAX78000EXG+ has multiple low-power modes, including shutdown, sleep, and hibernate. To configure these modes, use the EN, SLEEP, and HIBERNATE pins. Refer to the datasheet for specific pin configurations and register settings to achieve the desired low-power state.
  • The MAX78000EXG+ has a maximum junction temperature (TJ) of 150°C. Ensure good thermal dissipation by using a heat sink, thermal vias, and a thermally conductive PCB material. Also, consider the thermal resistance of the package (θJA) when designing your system.

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MAX78000EXG+ Overview

Use the download button to access the MAX78000EXG+ schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MAX78, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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Part Image MAX78000EXG+ Maxim Integrated Products

SoC, CMOS, PBGA81