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MC32PF3000A0EPR2 - NXP

Description: PMIC Solution 2.8V/3.7V to 4.5V/5.5V Medical 48-Pin QFN EP T/R

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Symbol
MC32PF3000A0EPR2 - NXP - PCB symbol
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PCB Footprints
MC32PF3000A0EPR2 - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 48QFn
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3D Models
MC32PF3000A0EPR2 - NXP - 3D model - Quad Flat No-Lead - 48QFn
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MC32PF3000A0EPR2 Details

  • Manufacturer Part Number:

    MC32PF3000A0EPR2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Additional Feature:

    ALSO REQUIRE SUPPLY VOLTAGE 3.7V TO 5.5V

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-XQCC-N48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    2.8 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MC32PF3000A0EPR2 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device's thermal pad should be connected to the ground plane using multiple thermal vias.
  • To ensure reliable communication, use a pull-up resistor on the memory's chip select line, and ensure the MCU's clock frequency is within the memory's specified range. Also, use a buffer or repeater if the distance between the MCU and memory is significant.
  • The recommended power-up sequence is to apply the core voltage (VDD) first, followed by the input/output voltage (VDDIO). This ensures that the internal voltage regulators are powered up correctly.
  • During production testing, ensure that the JTAG interface is not driven by the test equipment while the device is in reset. Also, use a JTAG adapter or a boundary scan controller to access the device's JTAG interface.
  • When using the internal oscillators, ensure that the oscillator pins are not loaded with external components, and that the oscillator frequency is within the specified range. Also, consider using an external crystal oscillator for more accurate timing.

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MC32PF3000A0EPR2 Overview

Use the download button to access the MC32PF3000A0EPR2 schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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