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- Part Number MC33660BEFR2
- Manufacturer NXP
- Pin Count 8
- Part Category Integrated Circuit
- Package Category Small Outline Packages
- Footprint Name Small Outline Packages - 8-Pin SOICN
- Released Date May 21, 2018
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
MC33660BEFR2 Details
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Manufacturer Part Number:
MC33660BEFR2
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
ROHS COMPLIANT, PLASTIC, MS-012AA, SOICN-8
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Country Of Origin:
Taiwan
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ECCN Code:
EAR99
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HTS Code:
8542.39.00.01
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Factory Lead Time:
16 Weeks
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Manufacturer:
NXP Semiconductors
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YTEOL:
1
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JESD-30 Code:
R-PDSO-G8
MC33660BEFR2 Frequently Asked Questions (FAQs)
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A good PCB layout for the MC33660BEFR2 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
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To optimize the power supply design, use a low-ESR capacitor (e.g., ceramic or film capacitor) for the input capacitor (CIN) and a low-ESR capacitor for the output capacitor (COUT). Ensure the input voltage is within the recommended range (7V to 18V) and the output voltage is set to the desired value (e.g., 5V or 3.3V).
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The MC33660BEFR2 can operate in an ambient temperature range of -40°C to 125°C. However, the device's performance and reliability may degrade at extreme temperatures. It's recommended to operate the device within a temperature range of 0°C to 85°C for optimal performance.
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To ensure EMC, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input and output lines. Additionally, use a layout that minimizes loop areas and keeps the analog and digital circuits separate.
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The MC33660BEFR2 has a thermal pad on the bottom of the package. Ensure good thermal contact between the thermal pad and the PCB by using a thermal interface material (e.g., thermal tape or thermal grease). A heat sink or a metal plate can also be used to dissipate heat.
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MC33660BEFR2 Overview
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About NXP
NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more.
NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.