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MC33GD3000EP - NXP

Description: Triple Half Bridge Motor Driver 6V Automotive 56-Pin QFN EP Tray

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Symbol
MC33GD3000EP - NXP - PCB symbol
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PCB Footprints
MC33GD3000EP - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT684-17
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3D Models
MC33GD3000EP - NXP - 3D model - Quad Flat No-Lead - SOT684-17
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MC33GD3000EP Details

  • Manufacturer Part Number:

    MC33GD3000EP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Analog IC - Other Type:

    3-PHASE BRUSHLESS DC MOTOR CONTROLLER

  • JESD-30 Code:

    S-PQCC-N56

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Supply Current-Max (Isup):

    95 mA

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

MC33GD3000EP Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN12247, which includes guidelines for component placement, routing, and thermal management.
  • NXP offers a range of application notes and design guides that provide guidance on optimizing the performance of the MC33GD3000EP in various applications, including motor control, power conversion, and industrial automation.
  • The MC33GD3000EP has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinking, thermal interface materials, and airflow management.
  • Yes, the MC33GD3000EP is designed for high-reliability and safety-critical applications. NXP provides documentation and support for functional safety and reliability, including FMEDA reports and safety manuals.
  • NXP provides guidance on EMC design considerations in the application note AN12247, including recommendations for PCB layout, component selection, and shielding.

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MC33GD3000EP Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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