13 X 13 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MO-275HHAC-1, BGA-206
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8542.39.00.01
Factory Lead Time:
26 Weeks
Manufacturer:
NXP Semiconductors
YTEOL:
0
Adjustable Threshold:
YES
Analog IC - Other Type:
INTEGRATED POWER MANAGEMENT UNIT
JESD-30 Code:
S-PBGA-B206
JESD-609 Code:
e1
Length:
13 mm
Moisture Sensitivity Level:
3
Number of Channels:
16
Number of Functions:
1
Number of Terminals:
206
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
LFBGA
Package Equivalence Code:
BGA206,15X15,32
Package Shape:
SQUARE
Package Style:
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
1.61 mm
Supply Voltage-Max (Vsup):
4.5 V
Supply Voltage-Min (Vsup):
3 V
Supply Voltage-Nom (Vsup):
3.6 V
Surface Mount:
YES
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Nickel/Gold (Ni/Au)
Terminal Form:
BALL
Terminal Pitch:
0.8 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
40
Width:
13 mm
MC34708VM Frequently Asked Questions (FAQs)
The recommended layout and placement for the MC34708VM involves placing the device close to the battery, using a solid ground plane, and keeping the input and output capacitors close to the device. A 4-layer PCB is recommended, with the top layer for signals, the second layer for power, the third layer for ground, and the bottom layer for signals.
To optimize the performance of the MC34708VM, ensure that the input voltage is within the recommended range, use a low-ESR output capacitor, and minimize the trace length and width to reduce parasitic inductance and resistance. Additionally, use a thermal pad to improve heat dissipation.
The MC34708VM has a thermal pad that must be connected to a solid ground plane to improve heat dissipation. The device can operate up to 125°C, but the junction temperature should be kept below 115°C for optimal performance and reliability.
To troubleshoot issues with the MC34708VM, check the input voltage, output voltage, and current consumption. Verify that the device is properly connected and that the layout and placement are correct. Use an oscilloscope to check for oscillations or noise on the output.
The MC34708VM is designed to meet EMI and EMC standards, but proper layout and placement, as well as the use of shielding and filtering, are still necessary to minimize electromagnetic interference and ensure electromagnetic compatibility.
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MC34708VM Overview
Use the download button to access the MC34708VM 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About NXP
NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more.
NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.
