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MC3PHACVDW - NXP

Description: IC MOTOR DRIVER 4.5V-5.5V 28SOIC

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MC3PHACVDW - NXP PCB footprint - Small Outline Packages - Small Outline Packages - 28-Pin SOIC (Case 751F)__
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MC3PHACVDW - NXP  - 3D model - Small Outline Packages - 28-Pin SOIC (Case 751F)__
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MC3PHACVDW Details

  • Manufacturer Part Number:

    MC3PHACVDW

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2016-07-20

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDSO-G28

  • Length:

    17.925 mm

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    220

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max (Isup):

    60 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

MC3PHACVDW Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a heat sink or thermal interface material, and ensure good airflow. Monitor the device's junction temperature (Tj) and adjust the thermal design accordingly.
  • The input signals should have a rise and fall time of ≤ 10 ns, and the input clock frequency should be within the specified range (e.g., 25 MHz to 50 MHz).
  • Use a shielded enclosure, ensure good PCB layout practices, and add EMI filters or chokes as needed. Follow NXP's EMI and EMC guidelines for the MC3PHACVDW.
  • Power up the device in the following sequence: VCC, VDD, and then the input signals. Power down in the reverse sequence. Ensure a minimum of 10 ms delay between power cycles.

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MC3PHACVDW Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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