MC56F8123VFBE - NXP

MC56F8123VFBE Details

• Manufacturer Part Number:

  MC56F8123VFBE

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Not Recommended

• Package Description:

  ROHS COMPLIANT, PLASTIC, LQFP-64

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  13 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  3

• Additional Feature:

  ALSO REQUIRES 3.3V SUPPLY

• Barrel Shifter:

  YES

• Bit Size:

  16

• Boundary Scan:

  YES

• Clock Frequency-Max:

  80 MHz

• Format:

  FIXED POINT

• Internal Bus Architecture:

  MULTIPLE

• JESD-30 Code:

  S-PQFP-G64

• JESD-609 Code:

  e3

• Length:

  10 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  64

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFQFP

• Package Shape:

  SQUARE

• Package Style:

  FLATPACK, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.6 mm

• Supply Voltage-Max:

  2.75 V

• Supply Voltage-Min:

  2.25 V

• Supply Voltage-Nom:

  2.5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  10 mm

• uPs/uCs/Peripheral ICs Type:

  DIGITAL SIGNAL PROCESSOR, CONTROLLER