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MC68HC11E1CFNE3 - NXP

Description: Microcontrollers

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MC68HC11E1CFNE3 - NXP PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - SOT238-4
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3D Models
MC68HC11E1CFNE3 - NXP  - 3D model - Plastic Leaded Chip Carrier - SOT238-4
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MC68HC11E1CFNE3 Details

  • Manufacturer Part Number:

    MC68HC11E1CFNE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, LCC-52

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Date Of Intro:

    1988-01-01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    SEATED HT-CALCULATED

  • Address Bus Width:

    16

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • CPU Family:

    6800

  • Clock Frequency-Max:

    12 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • External Data Bus Width:

    8

  • JESD-30 Code:

    S-PQCC-J52

  • JESD-609 Code:

    e3

  • Length:

    19.125 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    38

  • Number of Terminals:

    52

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Equivalence Code:

    LDCC52,.8SQ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    512

  • ROM (words):

    512

  • ROM Programmability:

    OTPROM

  • Seated Height-Max:

    5.08 mm

  • Speed:

    3 MHz

  • Supply Current-Max:

    35 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    HCMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    19.125 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

MC68HC11E1CFNE3 Frequently Asked Questions (FAQs)

  • The MC68HC11E1CFNE3 can operate at a maximum clock frequency of 2 MHz.
  • The MC68HC11E1CFNE3 has 12 KB of flash memory.
  • Yes, the MC68HC11E1CFNE3 is designed to operate in harsh environments and can withstand temperatures ranging from -40°C to 85°C.
  • Yes, the MC68HC11E1CFNE3 has 8-channel, 8-bit ADCs.
  • Yes, the MC68HC11E1CFNE3 has low power consumption and can be used in battery-powered devices. It has a typical current consumption of 10 mA at 2 MHz.

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MC68HC11E1CFNE3 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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