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MC7448VU1267ND - NXP

Description: IC MPU MPC74XX 1.267GHZ 360BGA

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Symbol
MC7448VU1267ND - NXP - PCB symbol
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PCB Footprints
MC7448VU1267ND - NXP PCB footprint - BGA - BGA - SOT1603-3_2025
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3D Models
MC7448VU1267ND - NXP - 3D model - BGA - SOT1603-3_2025
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MC7448VU1267ND Details

  • Manufacturer Part Number:

    MC7448VU1267ND

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    3A991.A.1

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    1267 MHz

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-CBGA-N360

  • Length:

    25 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    360

  • Operating Temperature-Max:

    105 °C

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    LGA

  • Package Equivalence Code:

    BGA360,19X19,50

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.8 mm

  • Speed:

    1267 MHz

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    1 V

  • Supply Voltage-Nom:

    1.05 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    25 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

MC7448VU1267ND Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in their application note AN5071, which includes guidelines for thermal vias, heat sinks, and PCB stack-up.
  • To optimize power consumption, use the device's power-saving modes (e.g., low-power mode, sleep mode), reduce the clock frequency, and minimize the number of active peripherals. Additionally, use the device's built-in power management features, such as the Power Management Controller (PMC).
  • To minimize EMI and ensure EMC, follow proper PCB design practices, such as using a solid ground plane, minimizing signal trace lengths, and using shielding and filtering components. NXP also provides EMI and EMC guidelines in their application note AN5071.
  • To ensure reliable operation, follow NXP's recommended operating conditions, use a suitable thermal management system, and implement protection mechanisms against overvoltage, undervoltage, and electrostatic discharge (ESD).
  • NXP provides a range of debugging and testing tools, including the CodeWarrior Development Studio, the MCUXpresso IDE, and the NXP LPC-Link2 debug probe. Additionally, third-party tools, such as oscilloscopes and logic analyzers, can be used to debug and test the device.

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MC7448VU1267ND Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image MC7448VU1267ND Freescale Semiconductor

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For a full list of alternate parts for MC7448VU1267ND, check out Findchips.com