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MFS1/4CC1002F - KOA Speer

Description: KOA Axial Metal Film Resistor 10kΩ ±1% 0.25W ±50ppm/°C

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PCB Footprints
MFS1/4CC1002F - KOA Speer PCB footprint - Resistors, Axial Diameter Horizontal Mounting - Resistors, Axial Diameter Horizontal Mounting - MFS1/4(Height 0.45mm)
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3D Models
MFS1/4CC1002F - KOA Speer  - 3D model - Resistors, Axial Diameter Horizontal Mounting - MFS1/4(Height 0.45mm)
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MFS1/4CC1002F Details

  • Manufacturer Part Number:

    MFS1/4CC1002F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    AXIAL LEADED

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.90

  • Manufacturer:

    KOA Speer Electronics Inc

  • YTEOL:

    9

  • Additional Feature:

    IEC60115-1

  • Construction:

    Tubular

  • JESD-609 Code:

    e2

  • Lead Diameter:

    0.45 mm

  • Lead Length:

    28 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Diameter:

    1.7 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    Axial

  • Packing Method:

    BULK

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    10000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Surface Mount:

    NO

  • Technology:

    METAL FILM

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    TIN COPPER

  • Terminal Shape:

    WIRE

  • Tolerance:

    1%

  • Working Voltage:

    250 V

MFS1/4CC1002F Frequently Asked Questions (FAQs)

  • The recommended land pattern for MFS1/4CC1002F is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While MFS1/4CC1002F is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum power rating at elevated temperatures. Additionally, the soldering process and PCB material selection should be suitable for high-temperature applications.
  • To prevent electrostatic discharge (ESD) damage, handle MFS1/4CC1002F components in an ESD-controlled environment, use ESD-protective packaging, and follow proper grounding procedures during assembly and testing. It's also recommended to implement ESD protection circuits in the design.
  • The recommended soldering profile for MFS1/4CC1002F is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process is within the specified temperature range to prevent damage to the component.
  • While MFS1/4CC1002F is not specifically designed for humid or moist environments, it can still be used in such conditions with proper precautions. Ensure that the component is properly sealed or coated, and the PCB is designed with moisture-resistant materials and conformal coating.

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MFS1/4CC1002F Overview

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